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Philips TDA8950 Instrukcja Użytkownika Strona 1

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1. General description
The TDA8950 is a high efficiency class-D audio power amplifier. The typical output power
is 2 × 150 W with a speaker load impedance of 4 Ω.
The TDA8950 is available in the HSOP24 power package and DBS23P power package.
The amplifier operates over a wide supply voltage range from ±12.5 V to ±40 V and
consumes a low quiescent current.
2. Features
n Pin compatible with TDA8920B for both HSOP24 and DBS23P packages
n Symmetrical high operating supply voltage range from ±12.5 V to ±40 V
n Stereo full differential inputs, usable as stereo Single-Ended (SE) or mono Bridge-Tied
Load (BTL) amplifier
n High output power at typical applications:
u SE 2 × 150 W, R
L
=4Ω (V
P
= ±37 V)
u SE 2 × 170 W, R
L
=4Ω (V
P
= ±39 V)
u SE 2 × 100 W, R
L
=6Ω (V
P
= ±37 V)
u BTL 1 × 300 W, R
L
=8Ω (V
P
= ±37 V)
n Low noise in BTL due to BD-modulation
n Smooth pop noise-free start-up and switch down
n Zero dead time Pulse Width Modulation (PWM) output switching
n Fixed frequency
n Internal or external clock switching frequency
n High efficiency
n Low quiescent current
n Advanced protection strategy: voltage protection and output current limiting
n Thermal foldback
n Fixed gain of 30 dB in SE and 36 dB in BTL
n Full short-circuit proof across load
3. Applications
n DVD
n Mini and micro receiver
n Home Theater In A Box (HTIAB) system
n High power speaker system
TDA8950
2 × 150 W class-D power amplifier
Rev. 01 — 9 September 2008 Preliminary data sheet
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Podsumowanie treści

Strona 1 - 3. Applications

1. General descriptionThe TDA8950 is a high efficiency class-D audio power amplifier. The typical output poweris 2 × 150 W with a speaker load impedance

Strona 2 - 5. Ordering information

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 10 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 3 - 6. Block diagram

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 11 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 4 - 7. Pinning information

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 12 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 5 - 8. Functional description

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 13 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 6 - 001aab172

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 14 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 7

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 15 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 8 - 8.3.1 Thermal protection

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 16 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 9

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 17 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 10 - NXP Semiconductors

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 18 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 11 - 8.4 Differential audio inputs

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 19 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 12 - 10. Thermal characteristics

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 2 of 39NXP SemiconductorsTDA89502 × 150 W class-D pow

Strona 13 - 11. Static characteristics

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 20 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 14 - 12. Dynamic characteristics

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 21 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 15

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Strona 16

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 23 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 17 - 13. Application information

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 24 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 18 - 13.3.2 Bridge-Tied Load (BTL)

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 25 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 19 - 13.6 Heatsink requirements

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 26 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 20 - 13.7 Output current limiting

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 27 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 21

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 28 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 22

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 29 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 23 - 13.10 Layout and grounding

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 3 of 39NXP SemiconductorsTDA89502 × 150 W class-D pow

Strona 24

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 30 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 25

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 31 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 26

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 32 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 27

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 33 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 28

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 34 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 29

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 35 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 30

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 36 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 31

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 37 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 32

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 38 of 39NXP SemiconductorsTDA89502 × 150 W class-D po

Strona 33 - 14. Package outline

NXP SemiconductorsTDA89502 × 150 W class-D power amplifier© NXP B.V. 2008. All rights reserved.For more information, please visit: http://www.nxp.comFo

Strona 34

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 4 of 39NXP SemiconductorsTDA89502 × 150 W class-D pow

Strona 35 - 15. Soldering of SMD packages

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 5 of 39NXP SemiconductorsTDA89502 × 150 W class-D pow

Strona 36 - 15.4 Reflow soldering

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 6 of 39NXP SemiconductorsTDA89502 × 150 W class-D pow

Strona 37 - 16. Revision history

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 7 of 39NXP SemiconductorsTDA89502 × 150 W class-D pow

Strona 38 - 18. Contact information

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 8 of 39NXP SemiconductorsTDA89502 × 150 W class-D pow

Strona 39 - 19. Contents

TDA8950_1 © NXP B.V. 2008. All rights reserved.Preliminary data sheet Rev. 01 — 9 September 2008 9 of 39NXP SemiconductorsTDA89502 × 150 W class-D pow

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