Philips TDA5051A Instrukcja Użytkownika Pobierz pdf (Strona 25)

Product data sheet Rev. 5 — 13 January 2011 25 of 29

NXP Semiconductors

TDA5051A

Home automation modem

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

17. Abbreviations

MSL: Moisture Sensitivity Level

Fig 25. Temperature profiles for large and small components

001aac84

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Table 11. Abbreviations

Acronym Description

ADC Analog-to-Digital Converter

AGC Automatic Gain Control

ASK Amplitude Shift Keying

CMOS Complementary Metal-Oxide Semiconductor

DAC Digital-to-Analog Converter

HF High-Frequency

I/O Input/Output

IC Integrated Circuit

LC inductor-capacitor filter

NRZ Non-Return-to-Zero

RMS Root Mean Squared

ROM Read-Only Memory

THD Total Harmonic Distortion

TTL Transistor-Transistor Logic

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Philips TDA5051A Instrukcja Użytkownika Strona 25